Condensation Reflow Soldering Machine - Made in Germany
Ideal for laboratory, prototyping and small production
Max PCB Size
430 x 230 x 20mm
This machine is designed for reflow soldering laboratory and prototype, single pieces and small quantities PCB's. Components such as QFPs. BGAs, Flip Chips as well s hybrids are processed defect freewith highest quality results.
Due to the small size of the system it can be used anywhere.
Features:
- Table model top loader
- Window to observe
- Suitable for BGA's, stacked packages
- Oxygen free soldering
- Homogenous temperature transmission on the complete assembly
- No overheating of components
TECHNICAL SPECIFICATIONS
| Energy supply | (Single Phase + Neutral + Ground) 220-240 Volt / 50-60 Hz |
| Power drawn | 1.500 Watt (ca. 8 A) |
| System dimensions | 605 x 375 x 305 mm (L x W x H) |
| max. solder product format | 430 x 230 x 20 mm (L x W x H) |
| Standard cycle time | ca. 15 Min |
| Soldering time | ca. 60 – 120 Seconds (depends on products) |
| Process temperature | (depends on medium type) 210 up to 240 °C |
| Weight | 10 kg |
| Cooling | Forced air cooling |
| Heat transfer medium | GALDEN with the correct boiling temperature (max. 240 °C) |
| Medium basic filling quantity | ca. 500– 800 ml GALDEN |
