ASSCON vapour-phase reflow soldering systems are an innovative response to modern soldering challenges. The physical principles of the process allow fault-free soldering of the most complex SMT modules in lead-free soldering pastes in virtually any arrangement. ASSCON’s vacuum soldering process combines the advantages of the vapour phase with the vacuum process.

• Lead-free soldering - no limitations

• Compact multi-chamber design

• Oxygen-free preheating and soldering

• Automatic fluid identification

• Max solder piece format 400 x 400 mm

• Max solder piece height - 85 mm

• Continuously adjustable temperature gradient

• Manufactured in 2016

****Used/Working - Sold in "as is" condition****